Complete compact 2K Dispensing metering resin machine
Main structural components of our potting and dispensing systems :
1. Two vacuum tanks
2. Two sucking hoses for feeding materials
3. Two sets of heating components
4. Two sets of stirrer blade with motors
5. Two sets of cylinder plunger pumps
6. Dual valves for glue potting process
7. One set of vacuum pump
8. One set of cleaning barrel
9. One set of PLC touch screen system
Main functions of our potting and dispensing machine:
1. Glue feeding from origin packs of resins .
2. Vacuum degas for A and B resins in tanks.
3. Tank stirring for A and B
4. Heating for A and B systems
5. Liquid level sensors of A and B tanks .
6. Self-cleaning for dispensing head (mixture in mixer tube)
7. Glue discharge function to avoid mixer tube cure in gap time .
8. Valve suck-back functions to prevent glue from dripping .
9. IO signal for connecting the production line and third party
platform if needed .
10. Foot pedal or hand held glue gun or trigger to dispense or pot glue
into products .
Characteristic of AB Epoxy resins
Epoxy resins have been widely used for many years – they are generally hard and
tough and exhibit low shrinkage on cure.
They are characterised by an excellent level of mechanical
properties, good high temperature performance and good adhesion to
a wide variety of substrates, and show excellent chemical
resistance across a wide range of chemicals.
The cross-linking or curing process generally takes place slowly
especially where small volumes of resin are involved.
Fast cure hardeners can be used but these generate a lot of heat
during cure, giving rise to a high exotherm which can damage
electronic components and cause high mechanical stresses on both
components and the circuit.
Epoxies Resins for Potting and Encapsulation in the Electronics and
Electrical Industries:
Our potting and dispensing stories for epoxy resins :
